Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?

CEO Pat Gelsinger earlier this year stated that Intel would be returning to product leadership in 2025, but hasn't yet explained how this is coming about - that is until today, where Intel has disclosed its roadmap for its next five generations of process node technology leading to 2025. While in Intel's recent Q3 2021 earnings call CEO Gelsinger confirmed that Intel is now producing more 10nm wafers in a day than 14nm wafers, marking a shift in confidence between the two designs, it is no secret that Intel has had difficulty in transitioning from its 14nm process to its 10nm process. 2022 H2, Intel 4: Previously known as Intel 7nm. Intel earlier this year stated that its Meteor Lake processor will use a compute tile based on this process node technology, and the silicon is now back in the lab being tested. 2024, Intel 20A: Previously known as Intel 5nm. Moving to double digit naming, with the A standing for Ångström, or 10A is equal to 1nm. Few details, but this is where Intel will move from FinFETs to its version of Gate-All-Around transistors called RibbonFETs. 2025, Intel 18A: Not listed on the diagram above, but Intel is expecting to have an 18A process in 2025. Intel has confirmed to us that Intel 3 and Intel 20A will be offered to foundry customers. Intel has however stated that moving from Intel 7 to Intel 4 will be a regular full node jump, with Intel 3 using modular parts of Intel 4 with new high performance libraries and silicon improvements for another jump in performance.